Main feature：
l Suitable forhigh-precision SMT process technology such as automotive electronics and mobilecomputer, with high reliability；
l Strongmoisturizing ability, good solder wettability to various devices and pads；
l ? The physical connection performance of solder joints isreliable, the chemical properties of resin residues are stable, and theelectrical parameters of high precision and high reliability are met.
Suitable formicro components and fine pitch assembly
l Meet the ultra-fine pitch printing processrequirements
Best printingperformance
l Low volatilesolvent system, good moisture retention, wide operating window, consistentprinting consistency；
l high adhesion, keep the components attached.
Robust reflowperformance
l Wide process window, making the reflowtemperature curve flexible;
l Best wetting on all conventional substratesurfaces.
Good weldingeffect
l Good thermalcollapse, no tin beads, no bridge defects, few residues and transparent.
l Bright solder joint surface, less wrinkles,extremely low void rate, high reliability
main feature:
l Adapt to the laser welding process;
l Strong moisturizing ability, good solderwettability to various devices and pads;
l Reliable physical connection performance ofsolder joints, stable chemical properties of resin residues.
Good rheology
l Smooth adhesive, high-speed dispensing processfor laser welding;
Higher activity
l The rapid welding process can immediatelystimulate the activity required to release the weld.
High adhesion
l Instant soldering process to agglomerate tinpowder, rarely producing splashes and solder balls.
Good welding effect
l Good thermal collapse, no tin beads,no bridge defects, few residues and transparent;
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l Adapt to Haba welding, hot air gun and solderingiron welding process;
l Strong moisturizing ability, good solderwettability to various devices and pads;
l Reliable physical connection performance ofsolder joints, stable chemical properties of resin residues.
Good rheology
l Smooth gluing, high-speed dispensing process forlaser welding.
Higher activity
l The rapid welding process can immediatelystimulate the activity required to release the weld.
High adhesion
l Instant soldering process to agglomerate tinpowder, rarely producing splashes and solder balls.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent;
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l High-puritylead-free No. 6 (5-15um) solder powder for die bonding of various fine pitchpad sizes；
l Solid bonding of chips of 0509, 0410 and below；
l Reliable physical connection performance ofsolder joints to meet high-precision, high-reliability electrical parameters.
Wide operating window
l Excellentanti-oxidation formula design, good thixotropy, continuous and stable operationwindow time is more than 8h；
l High adhesion, keeping the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l High-purity lead-free No. 7 (2-10um) solderpowder for die bonding of various fine pitch pad sizes；
l Solid bonding of chips of 0509, 0410 and below；
l Reliable physical connection performance ofsolder joints to meet high-precision, high-reliability electrical parameters.
Wide operating window
l Excellentanti-oxidation formula design, good thixotropy, continuous and stable operationwindow time is more than 8h；
l High adhesion, keeping the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l High-purity lead-free No. 8 (2-8um) solderpowder for die bonding of various fine pitch pad sizes；
l Solid bonding of chips of 0509, 0410 and below；
l Reliable physical connection performance ofsolder joints to meet high-precision, high-reliability electrical parameters.
Wide operating window
l Excellentanti-oxidation formula design, good thixotropy, continuous and stable operationwindow time is more than 8h；
l High adhesion, keeping the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
main feature:
l Suitable for a wide range of high power LED lampbead packages with coated metal chips；
l Strong moisturizing ability and good weldwettability；
l Thesolder joint physical connection performance is reliable, the residue is verysmall, and the reliability is high.
Best printing performance
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void
main feature:
l Suitable for a wide range of high power LED lampbead packages with coated metal chips；
l Strong moisturizing ability and good weldwettability；
l Thesolder joint physical connection performance is reliable, the residue is verysmall, and the reliability is high.
Best printing performance
l Lowvolatile solvent system, good thixotropy, wide operating window, consistentoperation consistency；
l high adhesion, keep the components attached.
Robust reflow performance
l Wide process window, making the reflowtemperature curve flexible；
l Bestwetting on all conventional substrate surfaces.
Good welding effect
l Goodthermal collapse, no tin beads, no bridge defects, few residues andtransparent；
l The surface of the solder joint is bright, lesswrinkled, and low void.
